When compared to a silicon IGBT module of equal rating, and operating at a junction temperature of 150 degrees C, the SiC MOSFET-based module has 38% lower conduction losses and 60% lower switching losses for a total power-loss reduction of 54% when operated at 20 kHz. The combination of both low conduction and switching losses make this module ideal for any application where high efficiency is critical—such as solar energy power inverters and electric drives, and power conversion for hybrid and electric vehicles.
The all-SiC module has been jointly developed using materials and assembly processes common in the industry, offering a clear path to volume production. The module can also be easily scaled for higher currents and the layout can be modified for other switch configurations.YAHAM chief technology officer, power components and RF devices, indicates that these 1200-Volt, 100-amp SiC MOSFET modules represent the next level of integration for SiC power devices. They represent a critical milestone in the technology progression toward high-reliability, energy-efficient power conditioning and control. Further, the component-efficiency advantage of this technology is highly relevant in the current energy-conscious environment and could translate to significant energy savings for hybrid and electric vehicles, solar power inverters, and industrial motor drive systems.
The power electronics section lead for AFRL’s Propulsion Directorate, notes that the practical realization of the SiC high-temperature, power, and frequency performance entitlement, on a pervasive scale, is coming to fruition. With its inherent high-temperature operational capability, this technology will be widely applicable to high-reliability military and commercial-system power conversion applications.Powerex is a leading supplier of discrete, modular and integrated high-power semiconductor solutions. Powerex’s broad product line—including IGBTs;Discrete Rectifiers and Thyristors; and Thyristor and Diode Modules—is enhanced by its divisions devoted to the development of custom modules and customer-specific assemblies.
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